Application of thermosetting copolyimides as coatings for protection of semiconductor devices

High Performance Polymers

Volumn 10, Issue 4, 1998, Pages 363-371

  Furukawa, Nobuyuki ^a   Katayama, Hisashi ^a   Kitamura, Ken Ich ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AROMATIC POLYMERS; COPOLYMERS; CROSSLINKING; CURING; ENCAPSULATION; POLYIMIDES; PROTECTIVE COATINGS; RESIDUAL STRESSES; SILICON WAFERS; STRESS ANALYSIS; THERMODYNAMIC PROPERTIES; THERMOSETS;

END-CAPPING AGENTS;

PLASTIC COATINGS;

EID: 0032309786     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1088/0954-0083/10/4/004     Document Type: Article

References (18)

1. Wilson D, Stenzenberger H D and Hergenrother P M (ed) 1990 Polyimides (New York: Blackie)
2. Lupinski J H and Moor R S (ed) 1988 Polymeric Materials for Electronics Packaging and Interconnection (Washington, DC: American Chemical Society)
3. Geldermans P, Goldsmith C and Bedetti F 1984 Polyimides 1st edn, vol 2, ed K L Mittal (New York: Plenum) p 695
4. Ghosh M K and Mittal K L (ed) 1996 Polyimides (New York: Dekker)
5. Yun H K, Cho K, An J H, Park C E, Sim S M and Park J M 1994 J. Adhes. Sci. Technol. 8 1395
6. Numata S, Misawa T, Makino D, Imaizumi J and Kinjyo N 1988 Mater. Res. Soc. Symp. Proc. 108 113
7. Biernath R W and Soane D S 1990 Nitto-Giho 28 (2) 13
8. Monk D J, He Y and Soane D S 1992 Mater. Res. Soc. Symp. Proc. 264 175
9. Bruck S M and Knorr D B 1992 Mater. Res. Symp. Soc. Proc. 264 251
10. Geldermans P, Goldsmith C and Bedetti F 1984 Polyimides vol 2 (New York: Plenum) p 715
11. Wilson A M 1984 Polyimides vol 2 (New York: Plenum) p 695
12. Bolger J C 1984 Polyimides vol 2 (New York: Plenum) p 871
13. Furukawa N and Yamada Y 1995 J. Adhes. Japan 31 438
14. Stenzenberger H D 1994 Adv. Polym. Sci. 117 164
15. Hou T H and Bryant R G 1997 High Perform. Polym. 9 437
16. Laurienzo P, Malcinconico M, Perenze N and Segre A L 1994 Macromol. Chem. Phys 195 3057
17. Spinv M, Brennau A, Rancourt J, Wilkes G L and McGrath J B 1990 Mater. Res. Soc. Symp. Proc. 175 179
18. Furukawa N, Yuasa M, Fujiyama T, Saito K, Shinohara M and Kimura Y 1998 Nippon Kagaku Kaishi 298