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Volumn 3582, Issue , 1998, Pages 608-616
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Square ring on square ring (SoS) ceramic strength testing technique for VLSI packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
BRITTLENESS;
CERAMIC MATERIALS;
FAILURE ANALYSIS;
FINITE ELEMENT METHOD;
MATERIALS TESTING;
MATHEMATICAL MODELS;
RELIABILITY;
STATISTICAL METHODS;
STRENGTH OF MATERIALS;
VLSI CIRCUITS;
WEIBULL DISTRIBUTION;
CERAMIC PIN GRID ARRAY PACKAGES;
SQUARE RING ON SQUARE RING CERAMIC TESTING;
ELECTRONICS PACKAGING;
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EID: 0032309566
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (19)
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