Investigations of electromigration failure by electrical measurement and scanning probe microscopy with additional simulation

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 27-32

  Fabricius, Alexander ^a   Breternitz, Volkmar ^a   Knedlik, Christian ^a   Henning, Andreas ^a   Liebscher, Eckhard ^a   Vogel, Silvia ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC BREAKDOWN; ELECTRIC RESISTANCE; ELECTROMIGRATION; FAILURE ANALYSIS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING ALUMINUM COMPOUNDS; STRESS ANALYSIS; TEMPERATURE MEASUREMENT;

SCANNING PROBE MICROSCOPY (SPM);

SEMICONDUCTOR DEVICE TESTING;

EID: 0032308875     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-516-27     Document Type: Conference Paper

References (8)