Simulation of boron nitride sputtering process and its comparison with experimental data

IEEE Transactions on Plasma Science

Volumn 26, Issue 6, 1998, Pages 1713-1717

  Chen, Meng ^a,b   Rohrbach, Guido ^a,b   Neuffer, Andreas ^a,b   Barth, Karl Ludwig ^a,b   Lunk, Achim ^a,b  

^a TSINGHUA UNIVERSITY   (China)

^b University of Missouri   (United States)

Author keywords

Boron nitride; Ion beams; Plasma applications; Simulation; Sputtering

Indexed keywords

ARGON; BINDING ENERGY; COMPUTER SIMULATION; COMPUTER SOFTWARE; CUBIC BORON NITRIDE; FILMS; INTERFACIAL ENERGY; ION BEAMS; ION BOMBARDMENT; ION SOURCES; PLASMA APPLICATIONS; SPUTTERING;

SOFTWARE PACKAGE TRIDYN; SOFTWARE PACKAGE TRIM; SURFACE BINDING ENERGY (SBE);

POLYCRYSTALLINE MATERIALS;

EID: 0032307632     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/27.747890     Document Type: Article

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