Copper versus magnesium as an alloying element in aluminum interconnects: Effects on electromigration

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 269-274

  Spolenak, R ^a   Mason, J ^a   Kraft, O ^a   Arzt, E ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALLOYING ELEMENTS; COMPOSITION EFFECTS; COPPER; ELECTROMIGRATION; MAGNESIUM; THERMAL EFFECTS;

DRIFT VELOCITY; ELECTRON PROBE MICROANALYSIS; INTERCONNECTS;

SEMICONDUCTOR MATERIALS;

EID: 0032307422     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-516-269     Document Type: Conference Paper

References (19)