Novel optical probing technique for flip chip packaged microprocessors

IEEE International Test Conference (TC)

Volumn , Issue , 1998, Pages 740-747

  Paniccia, Mario ^a   Eiles, Travis ^a   Rao, V R M ^a   Yee, Wai Mun ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INFRARED OPTICAL PROBES;

CMOS INTEGRATED CIRCUITS; FLIP CHIP DEVICES; INFRARED DEVICES; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PROBES; SEMICONDUCTOR JUNCTIONS; SILICON WAFERS; WAVEFORM ANALYSIS;

INTEGRATED CIRCUIT TESTING;

EID: 0032306936     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TEST.1998.743255     Document Type: Conference Paper

References (13)