Thermo-mechanical behaviors of flexible substrates

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 214-218

  Lu, Minfu ^a   Qian, Zhengfang ^a   Liu, Sheng ^a   Li, Ron ^a   Poglitsch, Larry ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; COPPER; DEFORMATION; DELAMINATION; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); RESINS; SUBSTRATES; THERMAL EFFECTS;

FLEXIBLE SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 0032306496     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)