Ultra-cut: A simple technique for the fabrication of SOI substrates with ultra-thin (<5 nm) silicon films

IEEE International SOI Conference

Volumn , Issue , 1998, Pages 145-146

  Hobart, K D ^a   Kub, F J ^a   Twigg, M E ^a   Jernigan, G G ^a   Thompson, P E ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ETCHING; ION IMPLANTATION; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; ULTRATHIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

BOND-AND-ETCH-BACK TECHNIQUES;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0032306067     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)