Investigation of the mechanical properties and adhesion of P.V.D. tungsten films on Si and silicon compounds by bulge and blister tests

Materials Research Society Symposium - Proceedings

Volumn 518, Issue , 1998, Pages 87-92

  Dupeux, Michel ^a   Bosseboeuf, Alain ^a   Buttard, Denis ^a  

^a UNIV GRENOBLE ALPES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; INTERFACIAL ENERGY; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; MECHANICAL TESTING; METALLIC FILMS; PHASE EQUILIBRIA; RESIDUAL STRESSES; SEMICONDUCTING SILICON COMPOUNDS; STRESS ANALYSIS;

BULGE AND BLISTER TESTS; INTERFACIAL FRACTURE ENERGY; MECHANICAL EQUILIBRIUM;

TUNGSTEN;

EID: 0032305039     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-518-87     Document Type: Conference Paper

References (12)