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Volumn 514, Issue , 1998, Pages 53-64
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Scaling and integration of high performance interconnects
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DIELECTRIC MATERIALS;
ELECTRIC WIRING;
INTEGRATED CIRCUIT LAYOUT;
LOGIC CIRCUITS;
PERMITTIVITY;
SEMICONDUCTING SILICON;
INTERCONNECT SYSTEMS;
INTERCONNECTION DELAY;
ELECTRIC WIRE;
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EID: 0032303781
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-514-53 Document Type: Conference Paper |
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Times cited : (1)
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References (6)
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