Newly developed low-K and low-stress fluorinated silicon oxide utilizing temperature-difference liquid-phase deposition technology

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 57-62

  Yeh, Ching Fa ^a   Lee, Yueh Chuan ^a   Lee, Su Chen ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DEHYDRATION; DEPOSITION; DIELECTRIC MATERIALS; DISSOLUTION; FLUORIDATION; LIQUID PHASE EPITAXY; MOISTURE; STRESSES; TEMPERATURE;

BOILING CYCLES; INTERMETAL DIELECTRIC; LIQUID PHASE DEPOSITION; LOW STRESS FLUORINATED SILICON OXIDE; MOISTURE ABSORPTION; SILICIC ACID;

SILICA;

EID: 0032302909     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-57     Document Type: Conference Paper

References (8)