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Volumn 511, Issue , 1998, Pages 277-290
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Chemical-mechanical planarization of the polymer interlayer dielectrics
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL POLISHING;
COPPER;
DEPOSITION;
DIELECTRIC MATERIALS;
GRINDING (COMMINUTION);
INTEGRATED CIRCUIT MANUFACTURE;
LITHOGRAPHY;
PERMITTIVITY;
REACTIVE ION ETCHING;
SEMICONDUCTOR DEVICE MANUFACTURE;
STRAIN;
SURFACES;
CHEMICAL MECHANICAL PLANARIZATION;
LOW DIELECTRIC CONSTANT;
POLYMERS;
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EID: 0032302271
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-511-277 Document Type: Conference Paper |
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Times cited : (6)
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References (29)
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