Packaging and instrumentation of a commercial pressure sensor for a high-G impact and the Martian environment

American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC

Volumn 66, Issue , 1998, Pages 401-406

  Reynolds, J Kurth ^a   Catling, David C ^a   Blue, Randy C ^a   Maluf, Nadim ^a   Kenny, Thomas W ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC TRANSDUCERS;

MICROPROBES;

PRESSURE TRANSDUCERS;

EID: 0032301028     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)