Transient and crosstalk analysis of interconnection lines for single level integrated packaging modules

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1998, Pages 120-123

  Zheng, L R ^a   Tenhunnen, H ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS;

INTERCONNECTION LINES;

MULTICHIP MODULES;

EID: 0032300145     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)