Stress analysis for the optimization of a new plastic package for optical sensors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3514, Issue , 1998, Pages 72-81

  Cotofana, C V B ^a   Bossche, A ^a   Mollinger, J ^a   Kaldenberg, P ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; OPTIMIZATION; PLASTICS APPLICATIONS; STRESS ANALYSIS;

OPEN QUAD FLAT PACKS (OQFP); OPEN WINDOW PLASTIC PACKAGES; QUAD FLAT PACK (QFP);

OPTICAL SENSORS;

EID: 0032298935     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)