Investigation of the homovalent impurity in aluminum to form alloys with enhanced interconnect reliability

Materials Research Society Symposium - Proceedings

Volumn 514, Issue , 1998, Pages 113-118

  Kailasam, Sridhar K ^a   Murarka, S P ^a   Glicksman, M E ^a   Merchant, S M ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRE; ELECTROMIGRATION; GRAIN BOUNDARIES; IMPURITIES; INTEGRATED CIRCUITS; METALLIZING;

ALUMINUM INTERCONNECTS; ELECTROMIGRATION RESISTANCE; ZERO FLUX PLANES;

ALUMINUM ALLOYS;

EID: 0032297542     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-514-113     Document Type: Conference Paper

References (12)