Characterization of epoxy-functionalized silsesquioxanes as potential underfill encapsulants

Materials Research Society Symposium - Proceedings

Volumn 519, Issue , 1998, Pages 15-20

  Lin, E K ^a   Snyder, C R ^a   Mopsik, F I ^a   Wallace, W E ^a   Wu, W L ^a   Zhang, C X ^a   Laine, R M ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENSITY (SPECIFIC GRAVITY); DENSITY MEASUREMENT (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; ENCAPSULATION; ETHERS; THERMAL EXPANSION;

EPOXY GROUPS; HYBRID MATERIALS; SILSESQUIOXANES;

SILICON COMPOUNDS;

EID: 0032297134     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-519-15     Document Type: Conference Paper

References (11)