Polymer/metal interfaces in interconnect structures: moisture diffusion and stress corrosion effects

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 329-339

  Ma, Qing ^a   Tran, Quan ^a   Pan, Chuanbin ^a   Fujimoto, Harry ^a   Chiang, Chien ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CALCULATIONS; CHEMICAL BONDS; DIFFUSION; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MOISTURE; POLYMERS; SILICA; STRAIN RATE; STRESS CORROSION CRACKING; TENSILE STRESS;

INTERCONNECT STRUCTURE; INTERFACE BONDING STRENGTH; POLYARYLENE ETHER;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0032292682     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-329     Document Type: Conference Paper

References (14)