Direct measurement of the adhesive fracture resistance of CVD diamond particles

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 367-371

  Kamiya, S ^a   Takahashi, H ^a   Saka, M ^a   Abe H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; NUCLEATION; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING DIAMONDS; SEMICONDUCTING FILMS; SILICON WAFERS; SYNTHETIC DIAMONDS;

ADHESIVE FRACTURE RESISTANCE; ADHESIVE STRENGTH;

DIAMOND FILMS;

EID: 0032292237     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792648     Document Type: Article

References (9)

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