Simultaneous fabrication of dielectric and electrical joints by wafer bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3514, Issue , 1998, Pages 62-71

  Drost, Andreas ^a   Klink, Gerhard ^a   Scherbaum, Sabine ^a   Feil, Michael ^a  

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIELECTRIC MATERIALS; ELECTRIC CONTACTORS; GLASS; PRESSURE TRANSDUCERS; SILICON WAFERS;

CAPACITIVE PRESSURE SENSORS; THERMOCOMPRESSION;

MICROELECTROMECHANICAL DEVICES;

EID: 0032291545     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)