Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn 2, Issue , 1998, Pages 186-187

  Brooke, Martin ^a   Jokerst, Nan Marie ^a   Bond, Steven W ^a   Wills, D Scott ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC LOSSES; MICROPROCESSOR CHIPS; OPTICAL LINKS; SEMICONDUCTOR DEVICE MODELS;

HIGH DENSITY ELECTRICAL INTERCONNECT;

OPTICAL INTERCONNECTS;

EID: 0032290351     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)