Effect of processing on the positive temperature coefficient of resistivity in lead metaplumbate/polyethylene composites

Polymer Composites

Volumn 19, Issue 6, 1998, Pages 781-786

  Huang, Z Z ^a,b   Yue, R ^a   Chan, H L W ^a   Choy, C L ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CERAMIC MATERIALS; ELECTRIC CONDUCTIVITY OF SOLIDS; FRACTURE; HIGH DENSITY POLYETHYLENES; HOT PRESSING; LEAD COMPOUNDS; MICROSTRUCTURE; POSITIVE TEMPERATURE COEFFICIENT; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; THERMAL EFFECTS;

LEAD METAPLUMBATE;

NONMETALLIC MATRIX COMPOSITES;

EID: 0032289192     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10152     Document Type: Article

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