Investigations of multi-layer ceramic-based MCM technology

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1998, Pages 83-86

  Sutono, A ^a   Pham, A ^a   Laskar, J ^a   Smith, W R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; LOW TEMPERATURE ENGINEERING; Q FACTOR MEASUREMENT;

LOW TEMPERATURE CO-FIRED CERAMICS;

MULTICHIP MODULES;

EID: 0032287757     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)