Moisture absorption effect on adhesive filled bonded joints

Polymer Composites

Volumn 19, Issue 6, 1998, Pages 680-688

  Ouddane, M ^a   Boukhili, R ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BONDING; CERAMIC MATERIALS; COMPOSITION EFFECTS; DURABILITY; GLASS; MOISTURE; PLASTIC ADHESIVES; PLASTICS FILLERS; STRENGTH OF MATERIALS; THERMAL EXPANSION; WATER ABSORPTION;

STEP LAP SHEAR ANALYSIS; THERMAL EXPANSION COEFFICIENTS; THERMOMECHANICAL ANALYSIS (TMA);

ADHESIVE JOINTS;

EID: 0032287715     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10140     Document Type: Article

References (32)

1. A. J. Kinloch, J. Adhes., 10, 193 (1979).
2. D. M. Brewis, J. Comyn, and J. L. Tegg, Int. J. Adhes. Adhes., 1, 35 (1980).
3. J. D. Venables, J. Mater. Sci., 19, 2431 (1984).
4. R. G. Schmidt and J. P. Bell, Adv. Polym. Sci., 75, 33, K. Dusck. ed., Springer Verlag. Berlin (1986).
5. J. D. Minford, Adhesive Bonding, p. 239, L.H. Lee ed., Plenum Press, New York (1991).
6. R. A. Gledhill and A. J. Kinloch, J. Adhes., 6, 315 (1974).
7. J. D. Venables, D. K. McNamara, J. M. Chen, and T. S. Sun, Appl. Surf Sci., 3, 88 (1979).
8. H. Leidheiser, Jr. and M. W. Kendig, Ind. Eng. Chem. Prod. Res. Dev., 17, 42 (1978).
9. J. W. Holubka, J. E. deVries, and R. A. Dickie, Ind. Eng. Chem. Prod. Res. Dev., 23, 1, 63 (1984).
10. A. Pattnaik and J. D. Meakin, J. AppL Polym. Sci. Appl. Polym. Sympos., 145 (1977).
11. T. Smith, J. Appl. Polym. Sci.: Appl. Polym. Sympos., 11 (1977).
12. B. B. Bowen, Sympos. Adhes. Adhes. State Art, University of Pittsburgh (May 1974).
13. J. S. Noland, Adhesion Science and Technology, p. 41. L.H. Lee, ed., Plenum Press, New York (1975).
14. A. W. Bethune, SAMPE J., 11, 4, 4 (1978).
15. Handbook of Fillers and Reinforcements for Plastics, H. S. Katz and J. V. Milewski. eds., Van Nostrand (1978).
16. N. Ho Sung, Engineered Materials Handbook, 3 p. 622. ASM International, New York (1990).
17. G. F. C. M. Lijten, H. M.Van Noort, and P. J.M. Beris. J. Elect. Manuf., 5, 4, 253 (1995).
18. J. C. Jagt, P.J.M. Beris, and G. F. C. M. Lijten, IEEE Trans.Compon. Pack. Manuf. Tech., B18. 2, 292 (1995).
19. Z. Lai and J. Liu, IEEE Trans. Compon. Pack. Manuf. Tech., B19, 3, 644 (1996).
20. J. Liu, L. Ljungkrona, and Z. Lai. IEEE Trans. Compon., Pock. Manuf. Tech. B18, 2, 313 (1995).
21. B. C. Ennis and J. G. Williams, Thermochimica Acto, 21, 355 (1977).
22. C. H. Shen and G. S. Springer, J. Compos. Mater., 10, 2 (1976).
23. L. LE-Sa'ad, M. I. Darby, and B. Yates, J. Mater. Sci., 24, 5, 1653 (1989).
24. M. Ouddane, R. Boukhili, and R. Gauvin, submitted to J. Mater. Sci., May 1997.
25. S. Elomari, R. Boukhili, and D. J. Lloyd, Acia Materialla, 44, 5, 1873 (1996).
26. S. Elomari, R. Boukhili, D. J. Lloyd, C. S. Marchi, and A. Mortensen. J. Mater. Sci. 32, 8, 2131 (1997).
27. R. B. Prime, Thermal Characterization of Polymeric Materials, p. 435, E. A. Turi, ed., Academic Press, New York (1985).
28. L. Holiday and J. Roberson, J. Mater. Sci., 8, 301 (1973).
29. R. S. Raghava, Polym. Compos., B, 1 (1988).
30. J. F. Shackelford, W. Alexandre, and J. S. Park. CRC Materials Science and Engineering Handbook, CRC Press Inc. Boca Raton, Fla. (1994).
31. J. W. Williams and F. J. Boerio, 37th Annual Conf., Reinf. Plast/Compos. Inst., The Soc. Plast. Ind., Session 2-D, 1 (1982).
32. A. Kaul, N. H. Sung, I. Chin, and C. S. P. Sung, Polym. Eng. Sci., 24, 7, 493 (1984).