A new solution for thermopiezoelectric solid with an insulated elliptic hole

Acta Mechanica Sinica/Lixue Xuebao

Volumn 14, Issue 2, 1998, Pages 157-170

  Qinghua, Qin ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Conformai mapping; Fracture; Piezoelectric; Thermal analysis

Indexed keywords

CONFORMAL MAPPING; FRACTURE; SOLIDS; THERMOANALYSIS;

INSULATED ELLIPTIC HOLE; THERMOPIEZOELECTRIC SOLID;

PIEZOELECTRIC MATERIALS;

EID: 0032279507     PISSN: 05677718     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf02487750     Document Type: Article

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