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Volumn , Issue , 1998, Pages 320-326
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Overview of plasma induced damage after dry etch processing
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDUCTIVE FILMS;
DEFECTS;
DRY ETCHING;
PLASMA ETCHING;
SILICON WAFERS;
PLASMA INDUCED WAFER CHARGING;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0032278102
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (9)
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