Developing a decoupling methodology with SPICE for multilayer printed circuit boards

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 1998, Pages 652-655

  O'Sullivan, Cornelius B ^a   Smith, Larry D ^a   Forehand, Douglas W ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC WAVE INTERFERENCE; SPURIOUS SIGNAL NOISE;

DECOUPLING CAPACITORS; POWER BUS; SOFTWARE PACKAGE SPICE;

PRINTED CIRCUIT BOARDS;

EID: 0032272389     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)