Wireless AQP pressure sensor using chirped SAW delay lines structures

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 1998, Pages 355-358

  Reindl, L ^a   Ruppel, C C W ^a   Riek, K ^a   Pankratz, T ^a   Weigel, R ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIAPHRAGMS; PRESSURE MEASUREMENT; PRESSURE TRANSDUCERS; SENSORS; ULTRASONIC TRANSDUCERS;

ALL-QUARTZ PACKAGE (AQP) TECHNOLOGY; INTERDIGITAL TRANSDUCERS (IDT);

ACOUSTIC SURFACE WAVE DEVICES;

EID: 0032271747     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)