Study and application of piezoresistive stress test chip for IC packages

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 19, Issue 11, 1998, Pages 812-817

  Jia, Songliang ^a   Zhu, Haoying ^a   Luo, Yanbin ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

PIEZOELECTRIC DEVICES; SENSORS;

BENDING STRENGTH; PIEZORESISTIVE STRESS TEST CHIP;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0032269268     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)