Temperature stable SAW devices using directly bonded LiTaO3/glass substrates

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 1998, Pages 335-338

  Sato, H ^a   Onishi, K ^a   Shimamura, T ^a   Tomita, Y ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; GLASS; LITHIUM COMPOUNDS; PIEZOELECTRIC MATERIALS; SINGLE CRYSTALS; THERMAL EXPANSION; THERMAL STRESS; THERMODYNAMIC STABILITY; ULTRASONIC TRANSMISSION; ULTRASONIC VELOCITY;

TEMPERATURE COEFFICIENT OF FREQUENCY (TCF); THERMAL EXPANSION COEFFICIENT (TEC);

ACOUSTIC SURFACE WAVE DEVICES;

EID: 0032262053     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)