Time-history popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1998, Pages 1-8

  Lau, John H ^a   Ouyang, Chien ^a   Chen, Ray ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; FRACTURE MECHANICS; INTERFACES (MATERIALS); STRENGTH OF MATERIALS; STRESS CONCENTRATION; STRESS INTENSITY FACTORS; THERMAL EXPANSION; THERMAL STRESS; TOUGHNESS;

INITIAL CRACK LENGTH; J INTEGRAL; PLASTIC BALL GRID ARRAY; SOLDER REFLOW; THERMAL MISMATCH;

ELECTRONICS PACKAGING;

EID: 0032258766     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)