Sub-0.25-micron interconnection scaling: Damascene copper versus subtractive aluminum

IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop

Volumn , Issue , 1998, Pages 337-346

  Stamper, A K ^a   McDevitt, T L ^a   Luce, S L ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CAPACITANCE MEASUREMENT; COPPER; ELECTRIC NETWORK ANALYSIS; ELECTRIC RESISTANCE MEASUREMENT; ELECTROMIGRATION; INTEGRATED CIRCUIT LAYOUT;

BACK-END-OF-THE-LINE (BEOL) WIRING; DAMASCENE-COPPER WIRING;

CMOS INTEGRATED CIRCUITS;

EID: 0032256593     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)