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Volumn , Issue , 1998, Pages 327-331
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Wet chemical cleaning for damaged layer removal inside the deep sub-micron contact hole
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Author keywords
[No Author keywords available]
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Indexed keywords
AMMONIUM COMPOUNDS;
CHEMICAL CLEANING;
ELECTRIC RESISTANCE;
HYDROFLUORIC ACID;
HYDROGEN PEROXIDE;
PLASMA ETCHING;
REACTIVE ION ETCHING;
SILICON WAFERS;
SURFACE ACTIVE AGENTS;
SURFACE CLEANING;
SURFACE ROUGHNESS;
AMMONIUM FLUORIDE;
CLEANING SOLUTIONS;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0032256592
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (12)
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