Measurement of residual stresses in encapsulant of a PQFP

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 286-290

  Lee, Derek Chun Yu ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; FINITE ELEMENT METHOD; RESIDUAL STRESSES;

HOLE DRILLING STRAIN GAGE (HDSG) METHODS; PLASTIC QUAD FLAT PACKS (PQFP);

ELECTRONICS PACKAGING;

EID: 0032230814     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)