Thin film polymeric materials in microelectronic packaging and interconnect

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 53-59

  Garrou, Philip ^a  

^a MCNC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLAT PANEL DISPLAYS; GALLIUM ARSENIDE; III-V SEMICONDUCTORS; INTEGRATED CIRCUIT INTERCONNECTS; INTERFACES (MATERIALS); MICROELECTRONICS; PACKAGING MATERIALS; POLYMERS; SILICA; SILICON OXIDES; ADHESION; DIELECTRIC MATERIALS; MECHANICAL PROPERTIES; ORGANIC POLYMERS; PERMITTIVITY; STRESS ANALYSIS; THERMODYNAMIC STABILITY; THIN FILMS; WATER ABSORPTION;

INSULATING LAYERS; MICROELECTRONIC APPLICATIONS; MICROELECTRONIC PACKAGING; ON CHIP INTERCONNECT; OPTICAL INTERCONNECT; SILICON SUBSTRATES; THIN FILM MATERIAL; THIN FILM POLYMERS;

THIN FILMS; ELECTRONICS PACKAGING;

INTERLAYER DIELECTRIC APPLICATIONS; ON CHIP INTERCONNECT; PLANARIZATION; PRINTED WIRING BOARD; THIN FILM POLYMERS; VIA FORMATION;

EID: 0032230690     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664433     Document Type: Conference Paper

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