Heat transfer and flow issues in manifold microchannel heat sinks: A CFD approach

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 246-250

  Poh, S T ^a   Ng, E Y K ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COMPUTATIONAL FLUID DYNAMICS; HEAT FLUX; HEAT SINKS; HEAT TRANSFER; MATHEMATICAL MODELS; PRESSURE; THERMOANALYSIS;

MANIFOLD MICROCHANNEL HEAT SINKS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032230557     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)