Effect of reflow condition on the characteristics of PBGA solder joint

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 264-268

  Fan, S H ^a   Chan, Y C ^a   Zou, X C ^a   Yu, Z Q ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

HEATING; SHEAR STRENGTH; SOLDERED JOINTS;

PLASTIC BALL GRID ARRAYS (PBGA) SOLDER JOINTS; REFLOW PROFILES;

ELECTRONICS PACKAGING;

EID: 0032230519     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)