Interconnect technology for giga-scale integration

International Conference on Solid-State and Integrated Circuit Technology Proceedings

Volumn , Issue , 1998, Pages 17-20

  Liu, Ruichen ^a   Pal, Chien Shing ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS;

GIGA-SCALE INTEGRATION;

MICROPROCESSOR CHIPS;

EID: 0032226779     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)