New approach to the investigation of interconnection delay for multichip models

International Conference on Solid-State and Integrated Circuit Technology Proceedings

Volumn , Issue , 1998, Pages 464-467

  Lai, Jin mei ^a   Lin, Zheng hui ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; SEMICONDUCTOR DEVICE MODELS;

INTERCONNECTION DELAY;

MULTICHIP MODULES;

EID: 0032226694     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)