VCSEL devices and packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3289, Issue , 1998, Pages 2-12

  Lebby, Michael S ^a   Claisse, Paul ^a   Jiang, Wenbin ^a   Kiley, Phil ^a   Roll, Mike ^a   Boughter, Larry ^a   Sanchez, Pilar ^a   Lawrence, Bob ^a  

^a MOTOROLA INC   (United States)

Author keywords

Array laser packaging; Autopower control; Discrete laser packaging; Optoelectronics; Packaging; Semiconductor laser packaging; VCSELs

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LIGHT EMISSION; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; PHOTODETECTORS; POWER CONTROL; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE STRUCTURES;

AUTOPOWER CONTROL; VERTICAL CAVITY SURFACE EMITTING LASERS;

SEMICONDUCTOR LASERS;

EID: 0032224732     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.305470     Document Type: Conference Paper

References (6)

1. Use of VCSEL arrays for parallel optical interconnects
2. Method of making a VCSEL
3. Key challenges and results of VCSELs in data links
4. Automatic power control of VCSELs using an angled lid TO-56 package
5. APC using VCSEL filp-chip