Novel model for on-chip heat dissipation

IEEE Asia-Pacific Conference on Circuits and Systems - Proceedings

Volumn , Issue , 1998, Pages 779-782

  Chiueh, Herming ^a   Draper, Jeffrey ^a   Luh, Louis ^a   Choma Jr , John ^a  

^a UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIFFERENTIAL EQUATIONS; HEAT TRANSFER; MICROPROCESSOR CHIPS; TEMPERATURE DISTRIBUTION; THERMODYNAMIC PROPERTIES; VLSI CIRCUITS;

DEFAULT OFFSET TEMPERATURE; HEAT TRANSPORT PROPERTIES; ON CHIP HEAT DISSIPATION;

INTEGRATED CIRCUIT LAYOUT;

EID: 0032218244     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)