Transient elastic and viscoelastic thermal stresses during laser drilling of ceramics

Journal of Heat Transfer

Volumn 120, Issue 4, 1998, Pages 892-898

  Modest, M F ^a  

^a The Pennsylvania State University   (United States)

Author keywords

Ablation; Heat transfer; Laser; Numerical methods; Stress

Indexed keywords

ELASTIC STRESS; LASER DRILLING; VISCOELASTIC STRESS;

CERAMIC MATERIALS; COMPUTER SIMULATION; CONTINUOUS WAVE LASERS; DRILLING; MATHEMATICAL MODELS; PULSED LASER APPLICATIONS; TEMPERATURE; TWO DIMENSIONAL; VISCOELASTICITY;

THERMAL STRESS;

CERAMICS; STRESS; THERMAL ANALYSIS;

EID: 0032216246     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2825908     Document Type: Article

References (26)

1. Bahr, H.-A., Schultrich, B., Weim, H.-J., Pflugbeil, L, Rüdiger, E., Wetzig, K., and Menzel, S., 1993, “Thermoschockrißbildung durch Laserinduzierte Hochtemperaturrelaxation,” Proceedings of Vortragsveranstaltung des DVM-Arbeits-kreises Bruchvorgänge, Karlsruhe, Germany, Feb., pp. 149-157.
2. Bang, S. Y., and Modest, M. F., 1991, “Multiple Reflection Effects on Evaporative Cutting With a Moving CW Laser, ” ASME Journal of Heat Transfer, Vol. 113, pp. 663-669.
3. Bang, S. Y., and Modest, M. F., 1992, “Evaporative Scribing with a Moving CW Laser-Effects of Multiple Reflections and Beam Polarization,” Proceedings of ICALEO '91, Laser Materials Processing, Vol. 74, San Jose, CA, pp. 288-304.
4. Bang, S. Y., Roy, S„ and Modest, M. F., 1993, “CW Laser Machining of Hard Ceramics-Part II: Effects of Multiple Reflections,” International Journal of Heat and Mass Transfer, Vol. 36, No. 14, pp. 3529-3540.
5. Boley, B. A., and Weiner, J. H., 1960, Theory of Thermal Stresses, John Wiley and Sons, New York.
6. Bradley, F., 1988, “Thermoelastic Analysis of Radiation-Heating Thermal Shock,” High Temperature Technology, Vol. 6, No. 2, pp. 63-72.
7. Copley S. W., Wallace, R. J., and Bass, M., 1983, “Laser Shaping of Materials,” E. A. Metzbower, ed, Lasers in Materials Processing, American Society for Metals, Metals Park, Ohio.
8. 2-Laser Processing of Silicon Carbide,” Journal of the American Ceramic Society, Vol. 73, No. 7, pp. 1947-1952.
9. Edington, J. W., Rowcliffe, D. J., and Henshall, J. L., 1975, “The Mechanical Properties of Silicon Nitride and Silicon Carbide Part I: Materials and Strength,” Powder Metallurgy International, Vol. 7, No. 2, pp. 82-96.
10. Ferrari, M., and Harding, J. H., 1992, “Thermal Stress Field in Plasma-Sprayed Ceramic Coatings,” ASME Journal of Energy Resources Technology, Vol. 114, pp. 105-109.
11. Folweiler, R. C., 1961, “Creep Behavior of Pore-Free Polycrystalline AUumi-num Oxide,” Journal of Applied Physics, Vol. 32, No. 5, pp. 773-778.
12. Gross, T. S., Hening, S. D., and Watt, D. W., 1991, “Crack Formation during Laser Cutting of Silicon,” Journal of Applied Physics, Vol. 69, No. 2, pp. 983-989.
13. Guan, Q., and Cao, Y., 1993, “Verification of FE Programs for Welding Thermal Strain-Stress Analysis Using High Temperature Moiré Measurement,” Journal of the International Institute of Welding, Vol. 31, No. 1, pp. 344-347.
14. Hasselman, D. P. H., and Singh, J. P., 1986, “Criteria for the Thermal Stress Failure of Brittle Structural Ceramics,” Thermal Stresses I, R. B. Hetnarski, ed., North-Holland, New York, Chapter 4.
15. Hasselman, D. P. H., Thomas, J. R., Kamat, M. P., and Satyamurthy, K., 1980, “Thermal Stress Analysis of Partially Absorbing Brittle Ceramics Subjected to Symmetric Radiation Heating,” Journal of the American Ceramic Society, Vol. 63, Nos. 1-2, pp. 21-25.
16. Hasselman, D. P. H., 1967, “Approximate Theory of Thermal Stress Resistance of Brittle Ceramics Involving Creep,” Journal of the American Ceramic Society, Vol. 50, pp. 454-457.
17. Lane, J. E., Carter, C. H., and Davis, R. F., 1988, “Kinetics and Mechanisms of High-Temperature Creep in Silicon Carbide: III, Sintered a-Silicon Carbide,” Journal of the American Ceramic Society, Vol. 71, No. 4, pp. 281-295.
18. Modest, M. F., and Abakians, H., 1986, “Evaporative Cutting of a Semi-Infinite Body With a Moving CW Laser,” ASME Journal of Heat Transfer, Vol. 108, pp. 602-607.
19. Modest, M. F., 1996, “Three-Dimensional, Transient Model for Laser Machining of Ablating/Decomposing Materials,” International Journal of Heat and Mass Transfer, Vol. 39, No. 2, pp. 221-234.
20. Modest, M. F., 1997, “Laser Through-Cutting and Drilling Models for Ablat-ing/Decomposing Materials,” Journal of Laser Applications, Vol. 9, No. 3, pp. 137-146.
21. Ramanathan, S., and Modest, M. F., 1990, “Effects of Variable Thermal Properties on Evaporative Cutting with a Moving CW Laser,” Heat Transfer in Space Systems, Vol. HTD-135, ASME, New York, pp. 101-108.
22. Roy, S., and Modest, M. F., 1993, “CW Laser Machining of Hard Ceramics- Part I: Effects of Three-Dimensional Conduction and Variable Properties and Various Laser Parameters,” International Journal of Heat and Mass Transfer, Vol. 36, No. 14, pp. 3515-3528.
23. Singh, J. P., Sumi, N., Thomas, J. R., and Hasselman, D. P. H., 1981, ‘ ‘Analysis of Thermal Stress Resistance of Partially Absorbing Ceramic Plate Subjected to Asymmetric Radiation, II: Convective Cooling at Front Surface,” Journal of the American Ceramic Society, Vol. 64, pp. 169-173.
24. Sumi, N., Hetnarski, R. B., and Noda, N., 1987, “Transient Thermal Stresses due to a Local Source of Heat Moving over the Surface of an Infinite Elastic Slab,” Journal of Thermal Stresses, Vol. 10, pp. 83-96.
25. Thomas, J. R., Singh, J. P., and Hasselman, D. P. H., 1981, “Analysis of Thermal Stress Resistance of Partially Absorbing Ceramic Plate Subjected to Asymmetric Radiation, I: Convective Cooling at Rear Surface,” Journal of the American Ceramic Society, Vol. 64, No. 3, pp. 163-173.
26. Yamamoto, J., and Yamamoto, Y., 1987, “Laser Machining of Silicon Nitride,” International Conference on Laser Advanced Materials Processing-Science and Applications, Osaka, Japan, High Temperature Society of Japan, Japan Laser Processing Society, pp. 297-302.