An investigation into the fabrication and properties of Ni3Al thin coatings on nickel substrates

Scripta Materialia

Volumn 39, Issue 12, 1998, Pages 1737-1742

  Ng, H P ^b   Meng, X K ^a,b   Ngan, A H W ^b  

^a NANJING UNIVERSITY   (China)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; LATTICE CONSTANTS; MICROHARDNESS; NICKEL; NICKEL ALLOYS; OXIDATION RESISTANCE; SPUTTERING; STOICHIOMETRY; THERMAL EXPANSION; THIN FILMS; WEAR RESISTANCE; X RAY DIFFRACTION ANALYSIS;

NICKEL ALUMINIDE; SURFACE STRENGTH; THERMAL OXIDATION RESISTANCE;

COATINGS;

EID: 0032207752     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00388-1     Document Type: Article

References (15)

1. M. Ohring, The Materials Science of Thin Films, Academic Press, Boston (1992).
2. H. W. Tawancy, N. M. Abbas, and T. N. Rhys-Jones, Surf. Coat. Technol. 49, 1 (1991).
3. H. C. Chen and E. Pfender, Thin Solid Films. 280, 188 (1996).
4. R. N. Wright, J. R. Fincke, W. D. Swank, D. C. Haggard, and C. R. Clark, Elevated Temperature Coatings: Science and Technology, 1, 157 (1995).
5. C. Leyens, K. H. Trautmann, M. Peters, and W. A. Kaysser, Scripta Mater. 36, 1309 (1997).
6. C. Leyens, M. Peters, and W. A. Kaysser, Scripta Mater. 35, 1423 (1996).
7. C. Leyens, M. Schmidt, M. Peters, and W. A. Kaysser, Mater. Sci. Eng. A. 239-240, 680 (1997).
8. T. Suzuki, H. Umehara, and R. Hayashi, J. Mater. Res. 9, 1028 (1994).
9. H. Umehara, T. Suzuki, and R. Hayashi, Mater. Trans. JIM. 37, 1138 (1996).
10. D. A. Hardwick and R. C. Cordi, Mater. Res. Soc. Sym. Proc. 194, 65 (1990).
11. P. F. Tortorelli and J. H. DeVan, Mater. Sci. Eng. A153, 573 (1992).
12. M. H. Staia, C. L. Leal, and J. C. Hidalgo, Elevated Temperature Coatings: Science and Technology, 1, 241 (1995).
13. C. T. Liu and J. O. Stiegler, Science. 226, 636 (1984).
14. J. H. Westbrook and R. L. Fleischer, Intermetallic Compounds, John Wiley & Sons, New York (1995).
15. B. Chapman, Glow Discharge Processes, John Wiley & Sons, New York (1980).