Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques

IEEE Transactions on Microwave Theory and Techniques

Volumn 46, Issue 11 PART 2, 1998, Pages 1850-1855

  Chuang, Jeff C P ^a   El Ghazaly, Samir M ^a  

^a AZ 85281   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTEGRATED OPTOELECTRONICS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING SILICON; SEMICONDUCTOR DOPING;

GLASS MICROBUMP BONDING (GMBB) TECHNIQUES;

MICROSTRIP LINES;

EID: 0032206809     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.734499     Document Type: Article

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