Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting technique

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 471-478

  Kosaka, Hideo ^a   Kajita, Mikihiro ^a   Sugimoto, Yoshimasa ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Optical fiber coupling; Optical interconnections; Parallel processing; Plastic packaging; Semiconductor device packaging; Semiconductor laser arrays; Surface mounting; Surface emitting lasers

Indexed keywords

BIT ERROR RATE; FLIP CHIP DEVICES; OPTICAL FIBER COUPLING; OPTICAL INTERCONNECTS; PARALLEL PROCESSING SYSTEMS; SEMICONDUCTOR LASERS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

MULTIFIBER PUSH-ON (MPO) FIBER CONNECTORS; VERTICAL-CAVITY SURFACE-EMITTING LASER (VCSEL) ARRAYS;

ELECTRONICS PACKAGING;

EID: 0032206031     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMB.1998.730433     Document Type: Article

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