Resin Transfer Process Monitoring and Control

SAMPE Journal

Volumn 34, Issue 6, 1998, Pages 48-55

  Lee, C William ^b   Rice, Brian P ^a   Buczek, Matthew ^d   Mason, Dave ^c  

^a UNIVERSITY OF DAYTON RESEARCH INSTITUTE   (United States)

^b UNIVERSITY OF DAYTON   (United States)

^c Aerospace Service and Controls

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

RESIN TRANSFER MOLDING (RTM);

CONTROL SYSTEMS; DECISION THEORY; FEEDBACK; HEATING; INTELLIGENT CONTROL; KNOWLEDGE BASED SYSTEMS; PRESSURE EFFECTS; PROCESS CONTROL; QUALITY CONTROL; REAL TIME SYSTEMS; SENSORS; VACUUM APPLICATIONS;

TRANSFER MOLDING;

EID: 0032203731     PISSN: 00911062     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (3)

1. Lee, C.W., Rice, B. and Buczek, M., "Direct Current Resistance Based Resin State Sensors," Proc. of the 41st International SAMPE Symposium, 1996.
2. Walsh, S., "Artificial Intelligence: Its Application to Composite Processing," Proc. of the 35th International SAMPE Symposium, April 2-5, 1990, pp. 1280-1291.
3. PR520 Epoxy Resin Introductory Data Sheet, 3M Aerospace Industrial Tape and Specialties Division, St. Paul, MM, November 1994.