Quantification of Local In-plane Displacements of Paper by Means of a New Measuring System;Quantifizierung lokaler Verformungen von Papier mit Hilfe einer neuen Meßtechnik

Papier

Volumn 52, Issue 11, 1998, Pages 649-654

  Wiens, Martin ^a   Göttsching, Lothar ^a   Dalpke, Barbara ^b  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOPLASTICITY; FRACTURE MECHANICS; STRAIN MEASUREMENT; TENSILE STRENGTH; TENSILE TESTING;

LOCAL IN-PLANE DISPLACEMENTS;

PAPER;

EID: 0032203233     PISSN: 00311340     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Sjödahl, M.: Electronic Speckle Photography applied to in-plane deformation and strain field measurements. Luleå, University of Technology, Division of Experimental Mechanics, Doctoral thesis D 171, 1995
2. Tanaka, A.; Otsuka, Y; Yamauchi, T.: Inplane fracture toughness testing of paper using thermography. Tappi J. 80 (1997), Nr. 5, 222-226