Some observations on liquid phase bonding of silicon nitride

Journal of Materials Science Letters

Volumn 17, Issue 21, 1998, Pages 1797-1799

  Xie, Rongjun ^a   Huang, Liping ^a   Chen, Yuan ^a   Fu, Xiren ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; BOND STRENGTH (MATERIALS); CERAMIC MATERIALS; COOLING; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; FRACTURE MECHANICS; GLASS BONDING; GRAIN BOUNDARIES; MORPHOLOGY; SINTERING; THERMAL EXPANSION;

LIQUID PHASE BONDING; PRESSURELESS SINTERING; THERMAL EXPANSION COEFFICIENTS;

SILICON NITRIDE;

EID: 0032202627     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1006657503999     Document Type: Article

References (5)

1. S. BAIK and R. RAJ, J. Am. Ceram. Soc. 70 (1987) C-105.
2. S. M. JOHNSON and D. J. ROWCLIFFE, ibid. 68 (1985) 468.
3. M. L. MECARTNEY and R. SINCLAIR, ibid. 68 (1985) 472.
4. B. S. CHIOU, C. O. YOUNG and J. G. DUH, J. Mater. Sci. 30 (1995) 1295.
5. D. N. COON, R. L. TALLMAN and R. M. NEILSON, Adv. Ceram. Mater. 3 (1988) 154.