Robust reliability design using environmental stress testing

Quality and Reliability Engineering International

Volumn 14, Issue 6, 1998, Pages 409-416

  Yang, Kai ^a,c,d,e,f   Yang, Guangbin ^{a,b,e,g,h,i,j}  

^a WAYNE STATE UNIVERSITY   (United States)

^b Yazaki North America Inc   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

^d IIE   (United States)

^e IEEE

^f AMERICAN STATISTICAL ASSOCIATION   (United States)

^g HANGZHOU DIANZI UNIVERSITY   (China)

^h ZHEJIANG UNIVERSITY   (China)

ⁱ FORD MOTOR COMPANY   (United States)

^j Ford Motor Company ^*  (China)

more..

Author keywords

Environmental stress testing; IC wire bonding; Reliability evaluation; Response surface analysis; Robust design; Taguchi's method

Indexed keywords

ENVIRONMENTAL TESTING; INTEGRATED CIRCUIT MANUFACTURE; PERFORMANCE; PRODUCT DESIGN;

ENVIRONMENTAL STRESS TESTING; ROBUST DESIGN;

RELIABILITY;

EID: 0032201684     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1099-1638(199811/12)14:6<409::aid-qre225>3.0.co;2-c     Document Type: Article

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