Heat-transfer enhancing features for handler tray-type device carriers

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 4, 1998, Pages 302-310

  Pfahnl, Andreas C ^a   Lienhard V, John H ^b   Slocum, Alexander H ^b  

^a Kinetrix Inc   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY LAYERS; HEAT CONVECTION; INTEGRATED CIRCUIT MANUFACTURE; MATERIALS HANDLING EQUIPMENT; THERMAL EFFECTS;

DEVICE THERMAL RESPONSES; HANDLER TRAY-TYPE DEVICE CARRIERS;

INTEGRATED CIRCUIT TESTING;

EID: 0032183969     PISSN: 10834400     EISSN: None     Source Type: None    
DOI: 10.1109/TCPMC.1998.739180     Document Type: Article

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